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Rochester Electronics TMS320C6727BZDH250

IC DSP FLOATING POINT 256BGA
part number has RoHS
Manufacturer # :TMS320C6727BZDH250
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6727BZDH250-DS
Customer # :
Description : IC DSP FLOATING POINT 256BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 25.7040$ 25.7
25+$ 25.1910$ 629.78
100+$ 24.1650$ 2416.5
500+$ 23.1300$ 11565
1000+$ 21.8520$ 21852
In Stock: 3525
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.704
Total :$ 25.70
Delivery :
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Payment :
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TMS320C6727BZDH250 information

  • Rochester Electronics TMS320C6727BZDH250 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:0°C ~ 90°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Type:Floating Point
  • Interface:EBI/EMI, HPI, I²C, McASP, SPI
  • Supplier Device Package:256-BGA (17x17)
  • Clock Rate:250MHz
  • Non- Volatile Memory:ROM (384kB)
  • On- Chip R A M:288kB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.20V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6727BZDH250 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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