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Rochester Electronics TMS320C6713BGDP300
IC FLOATING-POINT DSP 272-BGA
Manufacturer # :TMS320C6713BGDP300
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6713BGDP300-DS
Datasheet :
TMS320C6713BGDP300 Datasheet
TMS320C6713BGDP300 DatasheetCustomer # :
Description : IC FLOATING-POINT DSP 272-BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 2+ | $ 33.0660 | $ 66.13 |
| 4+ | $ 27.1305 | $ 108.52 |
| 6+ | $ 26.2827 | $ 157.7 |
| 8+ | $ 25.4349 | $ 203.48 |
| 10+ | $ 24.5871 | $ 245.87 |
In Stock: 13635
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 33.066
Total :$ 33.07
Delivery :
Payment :
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TMS320C6713BGDP300 information
Rochester Electronics TMS320C6713BGDP300 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:0°C ~ 90°C (TC)
- Mounting Type:Surface Mount
- Package / Case:272-BBGA
- Type:Floating Point
- Interface:Host Interface, I²C, McASP, McBSP
- Supplier Device Package:272-BGA (27x27)
- Clock Rate:300MHz
- Non- Volatile Memory:External
- On- Chip R A M:264kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.40V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6713BGDP300 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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