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Rochester Electronics TMS320C6672ACYP25
IC DSP FIX/FLOAT POINT 841FCBGA
Manufacturer # :TMS320C6672ACYP25
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6672ACYP25-DS
Datasheet :
TMS320C6672ACYP25 Datasheet
TMS320C6672ACYP25 DatasheetCustomer # :
Description : IC DSP FIX/FLOAT POINT 841FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 44+ | $ 455.0559 | $ 20022.46 |
In Stock: 2386
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 455.0559
Total :$ 455.06
Delivery :
Payment :
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TMS320C6672ACYP25 information
Rochester Electronics TMS320C6672ACYP25 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TC)
- Mounting Type:Surface Mount
- Package / Case:841-BFBGA, FCBGA
- Type:Fixed/Floating Point
- Interface:EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
- Supplier Device Package:841-FCBGA (24x24)
- Clock Rate:1.25GHz
- Non- Volatile Memory:ROM (128kB)
- On- Chip R A M:5.125MB
- Voltage - I/ O:1.0V, 1.5V, 1.8V
- Voltage - Core:1.00V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:4 (72 Hours)
- REACH Status:REACH Unaffected
- US ECCN:5A991B4A
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6672ACYP25 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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