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Rochester Electronics TMS320C6655CZH

IC DSP FIX/FLOAT POINT 625FCBGA
part number has RoHS
Manufacturer # :TMS320C6655CZH
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6655CZH-DS
Customer # :
Description : IC DSP FIX/FLOAT POINT 625FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 59.8140$ 59.81
25+$ 58.6170$ 1465.43
100+$ 56.2230$ 5622.3
500+$ 53.8290$ 26914.5
1000+$ 50.8410$ 50841
In Stock: 4116
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 59.814
Total :$ 59.81
Delivery :
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Payment :
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TMS320C6655CZH information

  • Rochester Electronics TMS320C6655CZH technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:625-BFBGA, FCBGA
  • Type:Fixed/Floating Point
  • Interface:DDR3, EBI/EMI, Ethernet, McBSP, PCIe, I²C, SPI, UART, UPP
  • Supplier Device Package:625-FCBGA (21x21)
  • Clock Rate:1GHz
  • Non- Volatile Memory:ROM (128kB)
  • On- Chip R A M:2.06MB
  • Voltage - I/ O:1.0V, 1.5V, 1.8V
  • Voltage - Core:1.00V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6655CZH provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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