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Rochester Electronics TMS320C6474FZUNA2

IC DSP MILTICORE 561FCBGA
part number has RoHS
Manufacturer # :TMS320C6474FZUNA2
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6474FZUNA2-DS
Customer # :
Description : IC DSP MILTICORE 561FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 248.0490$ 248.05
25+$ 243.0900$ 6077.25
100+$ 233.1630$ 23316.3
500+$ 223.2450$ 111622.5
1000+$ 210.8430$ 210843
In Stock: 12854
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 248.049
Total :$ 248.05
Delivery :
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TMS320C6474FZUNA2 information

  • Rochester Electronics TMS320C6474FZUNA2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Discontinued at Digi-Key
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:561-BFBGA, FCBGA Exposed Pad
  • Type:Fixed Point
  • Interface:Ethernet MAC, I²C, McBSP
  • Supplier Device Package:561-FCBGA (23x23)
  • Clock Rate:1.2GHz
  • Non- Volatile Memory:ROM (64kB)
  • On- Chip R A M:3.168MB
  • Voltage - I/ O:1.1V, 1.8V
  • Voltage - Core:1.10V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6474FZUNA2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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