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Rochester Electronics TMS320C6472EZTZ

IC DSP FIXED-POINT 737FCBGA
part number has RoHS
Manufacturer # :TMS320C6472EZTZ
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6472EZTZ-DS
Customer # :
Description : IC DSP FIXED-POINT 737FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
7+$ 55.1394$ 385.98
10+$ 54.0366$ 540.37
100+$ 52.3824$ 5238.24
500+$ 50.7282$ 25364.1
1000+$ 49.6255$ 49625.5
In Stock: 14978
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 55.1394
Total :$ 55.14
Delivery :
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TMS320C6472EZTZ information

  • Rochester Electronics TMS320C6472EZTZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:737-BFBGA, FCBGA
  • Type:Fixed Point
  • Interface:Ethernet MAC, Host Interface, I²C, Telecom, UTPOIA
  • Supplier Device Package:737-FCBGA (24x24)
  • Clock Rate:500MHz
  • Non- Volatile Memory:ROM (768kB)
  • On- Chip R A M:1.44MB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.00V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6472EZTZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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