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Rochester Electronics TMS320C6454BCTZ

IC DSP FIXED-POINT 697FCBGA
part number has RoHS
Manufacturer # :TMS320C6454BCTZ
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6454BCTZ-DS
Customer # :
Description : IC DSP FIXED-POINT 697FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 178.3710$ 178.37
25+$ 174.8070$ 4370.18
100+$ 167.6700$ 16767
500+$ 160.5330$ 80266.5
1000+$ 151.6140$ 151614
In Stock: 3960
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 178.371
Total :$ 178.37
Delivery :
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TMS320C6454BCTZ information

  • Rochester Electronics TMS320C6454BCTZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Not For New Designs
  • Operating Temperature:0°C ~ 90°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:697-BFBGA, FCBGA
  • Type:Fixed Point
  • Interface:Host Interface, I²C, McBSP, PCI, 10/100/1000 Ethernet MAC
  • Supplier Device Package:697-FCBGA (24x24)
  • Clock Rate:1GHz
  • Non- Volatile Memory:ROM (32kB)
  • On- Chip R A M:1.08MB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.25V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6454BCTZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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