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Rochester Electronics TMS320C6421ZDU7

IC DSP FIXED-POINT 376-BGA
part number has RoHS
Manufacturer # :TMS320C6421ZDU7
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6421ZDU7-DS
Customer # :
Description : IC DSP FIXED-POINT 376-BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 29.2140$ 29.21
25+$ 28.6290$ 715.73
100+$ 27.4590$ 2745.9
500+$ 26.2890$ 13144.5
1000+$ 24.8310$ 24831
In Stock: 1588
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 29.214
Total :$ 29.21
Delivery :
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TMS320C6421ZDU7 information

  • Rochester Electronics TMS320C6421ZDU7 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:0°C ~ 90°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:376-BBGA Exposed Pad
  • Type:Fixed Point
  • Interface:HPI, I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
  • Supplier Device Package:376-BGA (23x23)
  • Clock Rate:700MHz
  • Non- Volatile Memory:ROM (64kB)
  • On- Chip R A M:96kB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.05V, 1.20V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6421ZDU7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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