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Rochester Electronics TMS320C6202BGNY300
IC DSP FIXED-POINT 384-FC/CSP
Manufacturer # :TMS320C6202BGNY300
Manufacturer :Rochester Electronics
Dasenic # :TMS320C6202BGNY300-DS
Datasheet :
TMS320C6202BGNY300 Datasheet
TMS320C6202BGNY300 DatasheetCustomer # :
Description : IC DSP FIXED-POINT 384-FC/CSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 104.5800 | $ 104.58 |
| 25+ | $ 102.4920 | $ 2562.3 |
| 100+ | $ 98.3070 | $ 9830.7 |
| 500+ | $ 94.1220 | $ 47061 |
| 1000+ | $ 88.8930 | $ 88893 |
In Stock: 1563
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 104.58
Total :$ 104.58
Delivery :
Payment :
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TMS320C6202BGNY300 information
Rochester Electronics TMS320C6202BGNY300 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Not For New Designs
- Operating Temperature:0°C ~ 90°C (TC)
- Mounting Type:Surface Mount
- Package / Case:384-FBGA, FCCSPBGA
- Type:Fixed Point
- Interface:McBSP
- Supplier Device Package:384-FC/CSP (18x18)
- Clock Rate:300MHz
- Non- Volatile Memory:External
- On- Chip R A M:384kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.50V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C6202BGNY300 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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