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Rochester Electronics TMS320C54V90BPGE

IC DSP EMBED V.90 MODEM 144-LQFP
part number has RoHS
Manufacturer # :TMS320C54V90BPGE
Manufacturer :Rochester Electronics
Dasenic # :TMS320C54V90BPGE-DS
Customer # :
Description : IC DSP EMBED V.90 MODEM 144-LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 15.8040$ 15.8
25+$ 15.4890$ 387.23
100+$ 14.8590$ 1485.9
500+$ 14.2200$ 7110
1000+$ 13.4370$ 13437
In Stock: 8652
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 15.804
Total :$ 15.80
Delivery :
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TMS320C54V90BPGE information

  • Rochester Electronics TMS320C54V90BPGE technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Not For New Designs
  • Operating Temperature:0°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:144-LQFP
  • Type:Fixed Point
  • Interface:Host Interface, McBSP
  • Supplier Device Package:144-LQFP (20x20)
  • Clock Rate:117MHz
  • Non- Volatile Memory:ROM (256kB)
  • On- Chip R A M:80kB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.50V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320C54V90BPGE provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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