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1 : $44.1180
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Rochester Electronics TMS320BC53PQ57
IC DSP 132-BQFP
Manufacturer # :TMS320BC53PQ57
Manufacturer :Rochester Electronics
Dasenic # :TMS320BC53PQ57-DS
Datasheet :
TMS320BC53PQ57 Datasheet
TMS320BC53PQ57 DatasheetCustomer # :
Description : IC DSP 132-BQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 44.1180 | $ 44.12 |
| 25+ | $ 43.2360 | $ 1080.9 |
| 100+ | $ 41.4720 | $ 4147.2 |
| 500+ | $ 39.7080 | $ 19854 |
| 1000+ | $ 37.5030 | $ 37503 |
In Stock: 3456
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 44.118
Total :$ 44.12
Delivery :
Payment :
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TMS320BC53PQ57 information
Rochester Electronics TMS320BC53PQ57 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:132-BQFP Bumpered
- Type:Fixed Point
- Interface:BSP, SSP, TDM
- Supplier Device Package:132-BQFP (24.54x24.54)
- Clock Rate:57MHz
- Non- Volatile Memory:ROM (32kB)
- On- Chip R A M:8KB
- Voltage - I/ O:5.00V
- Voltage - Core:5.00V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320BC53PQ57 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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