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Rochester Electronics TMC1175AR3C40
Manufacturer # :TMC1175AR3C40
Manufacturer :Rochester Electronics
Dasenic # :TMC1175AR3C40-DS
Datasheet : TMC1175AR3C40 Datasheet
Customer # :
Description : 8-BIT ADC, FLASH METHOD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1913
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.632
Total :$ 7.63
Delivery :
Payment :
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TMC1175AR3C40 information
Rochester Electronics TMC1175AR3C40 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Active
- Operating Temperature:-20°C ~ 75°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Input Type:Single Ended
- Supplier Device Package:28-PLCC (11.51x11.51)
- Configuration:S/H-ADC
- Sampling Rate ( Per Second):40M
- Data Interface:Parallel
- Number of Bits:8
- Voltage - Supply, Analog:4.75V ~ 5.25V
- Voltage - Supply, Digital:4.75V ~ 5.25V
- Number of Inputs:1
- Ratio - S/ H: A D C:1:2
- Number of A/ D Converters:2
- Architecture:Two-Step, Flash
- Reference Type:External, Supply
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMC1175AR3C40 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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