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Rochester Electronics TLV3702IDGK

IC COMP DUAL P-P NANOPWR 8VSSOP
part number has RoHS
Manufacturer # :TLV3702IDGK
Manufacturer :Rochester Electronics
Dasenic # :TLV3702IDGK-DS
Customer # :
Description : IC COMP DUAL P-P NANOPWR 8VSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
5+$ 0.8710$ 4.36
10+$ 0.8656$ 8.66
In Stock: 1976
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.871
Total :$ 0.87
Delivery :
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Payment :
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TLV3702IDGK information

  • Rochester Electronics TLV3702IDGK technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Comparators
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Type:General Purpose
  • Output Type:CMOS, Push-Pull, Rail-to-Rail
  • Supplier Device Package:8-VSSOP
  • Number of Elements:2
  • Voltage - Supply, Single/ Dual (±):2.7V ~ 16V, ±1.35V ~ 8V
  • Voltage - Input Offset ( Max):5mV @ 15V
  • Current - Input Bias ( Max):250pA @ 15V
  • Current - Output ( Typ):10mA
  • Current - Quiescent ( Max):1µA
  • C M R R, P S R R ( Typ):88dB CMRR, 105dB PSRR
  • Propagation Delay ( Max):-
  • Hysteresis:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV3702IDGK provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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