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Rochester Electronics TLV320AIC24IPFB

IC CODEC PROG DUAL-CH LP 48-TQFP
part number has RoHS
Manufacturer # :TLV320AIC24IPFB
Manufacturer :Rochester Electronics
Dasenic # :TLV320AIC24IPFB-DS
Customer # :
Description : IC CODEC PROG DUAL-CH LP 48-TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 10.8990$ 10.9
25+$ 10.6830$ 267.08
100+$ 10.2420$ 1024.2
500+$ 9.8100$ 4905
1000+$ 9.2610$ 9261
In Stock: 8006
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.899
Total :$ 10.90
Delivery :
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Payment :
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TLV320AIC24IPFB information

  • Rochester Electronics TLV320AIC24IPFB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - CODECs
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:48-TQFP
  • Type:Voice-Band
  • Supplier Device Package:48-TQFP (7x7)
  • Resolution ( Bits):16 b
  • Data Interface:Serial
  • Voltage - Supply, Analog:2.7V ~ 3.6V
  • Voltage - Supply, Digital:1.65V ~ 1.95V
  • Number of A D Cs / D A Cs:2 / 2
  • Sigma Delta:Yes
  • S/ N Ratio, A D Cs / D A Cs (db) Typ:84 / 92
  • Dynamic Range, A D Cs / D A Cs (db) Typ:87 / 92
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV320AIC24IPFB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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