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Rochester Electronics TLV320AIC14CDBT
Manufacturer # :TLV320AIC14CDBT
Manufacturer :Rochester Electronics
Dasenic # :TLV320AIC14CDBT-DS
Datasheet : TLV320AIC14CDBT Datasheet
Customer # :
Description : IC CODEC 16BIT 26KSPS 30-TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 21415
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.19
Total :$ 8.19
Delivery :
Payment :
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TLV320AIC14CDBT information
Rochester Electronics TLV320AIC14CDBT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:30-TFSOP (0.173", 4.40mm Width)
- Type:Voice-Band
- Supplier Device Package:30-TSSOP
- Resolution ( Bits):16 b
- Data Interface:Serial
- Voltage - Supply, Analog:2.7V ~ 3.6V
- Voltage - Supply, Digital:1.65V ~ 1.95V
- Number of A D Cs / D A Cs:1 / 1
- Sigma Delta:Yes
- S/ N Ratio, A D Cs / D A Cs (db) Typ:84 / 92
- Dynamic Range, A D Cs / D A Cs (db) Typ:85 / 92
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV320AIC14CDBT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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