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Rochester Electronics TLV320AIC12CDBT

IC CODEC 1CH 16 BIT 3.3V 30TSSOP
part number has RoHS
Manufacturer # :TLV320AIC12CDBT
Manufacturer :Rochester Electronics
Dasenic # :TLV320AIC12CDBT-DS
Customer # :
Description : IC CODEC 1CH 16 BIT 3.3V 30TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 7.5600$ 7.56
25+$ 7.4070$ 185.18
100+$ 7.1100$ 711
500+$ 6.8040$ 3402
1000+$ 6.4260$ 6426
In Stock: 30354
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.56
Total :$ 7.56
Delivery :
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TLV320AIC12CDBT information

  • Rochester Electronics TLV320AIC12CDBT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - CODECs
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:30-TFSOP (0.173", 4.40mm Width)
  • Type:Voice-Band
  • Supplier Device Package:30-TSSOP
  • Resolution ( Bits):16 b
  • Data Interface:Serial
  • Voltage - Supply, Analog:2.7V ~ 3.6V
  • Voltage - Supply, Digital:1.65V ~ 1.95V
  • Number of A D Cs / D A Cs:1 / 1
  • Sigma Delta:Yes
  • S/ N Ratio, A D Cs / D A Cs (db) Typ:84 / 92
  • Dynamic Range, A D Cs / D A Cs (db) Typ:85 / 92
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV320AIC12CDBT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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