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Rochester Electronics TLV2402IDGKG4
IC OPAMP GP 5.5KHZ RRO 8VSSOP
Manufacturer # :TLV2402IDGKG4
Manufacturer :Rochester Electronics
Dasenic # :TLV2402IDGKG4-DS
Datasheet :
TLV2402IDGKG4 Datasheet
TLV2402IDGKG4 DatasheetCustomer # :
Description : IC OPAMP GP 5.5KHZ RRO 8VSSOP
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| Quantity | Unit Price | Total |
In Stock: 2556
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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Payment :
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TLV2402IDGKG4 information
Rochester Electronics TLV2402IDGKG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Current - Supply:900nA (x2 Channels)
- Output Type:Rail-to-Rail
- Supplier Device Package:8-VSSOP
- Number of Circuits:2
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:200 µA
- Slew Rate:0.0025V/µs
- Gain Bandwidth Product:5.5 kHz
- Current - Input Bias:100 pA
- Voltage - Input Offset:390 µV
- Voltage - Supply Span ( Min):2.5 V
- Voltage - Supply Span ( Max):16 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV2402IDGKG4 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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