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Rochester Electronics TLV2244IN
Manufacturer # :TLV2244IN
Manufacturer :Rochester Electronics
Dasenic # :TLV2244IN-DS
Datasheet : TLV2244IN Datasheet
Customer # :
Description : IC OPAMP GP 4 CIRCUIT 14DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9587
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.935
Total :$ 1.94
Delivery :
Payment :
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TLV2244IN information
Rochester Electronics TLV2244IN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Through Hole
- Package / Case:14-DIP (0.300", 7.62mm)
- Current - Supply:1µA (x4 Channels)
- Output Type:Rail-to-Rail
- Supplier Device Package:14-PDIP
- Number of Circuits:4
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:200 µA
- Slew Rate:0.002V/µs
- Gain Bandwidth Product:5.5 kHz
- Current - Input Bias:100 pA
- Voltage - Input Offset:600 µV
- Voltage - Supply Span ( Min):2.5 V
- Voltage - Supply Span ( Max):12 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TLV2244IN provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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