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Rochester Electronics TLE7230R
Manufacturer # :TLE7230R
Manufacturer :Rochester Electronics
Dasenic # :TLE7230R-DS
Datasheet : TLE7230R Datasheet
Customer # :
Description : TLE7230 - SPIDER - SPI DRIVER FO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 13992
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.336
Total :$ 6.34
Delivery :
Payment :
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TLE7230R information
Rochester Electronics TLE7230R technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Features:Slew Rate Controlled
- Mounting Type:Surface Mount
- Package / Case:36-BSSOP (0.433", 11.00mm Width) Exposed Pad
- Input Type:Non-Inverting
- Output Type:N-Channel
- Interface:SPI
- Supplier Device Package:PG-DSO-36-47
- Ratio - Input: Output:1:1
- Voltage - Supply ( Vcc/ Vdd):Not Required
- Number of Outputs:8
- Fault Protection:Current Limiting (Fixed), Over Temperature, Over Voltage, Short Circuit
- Output Configuration:Low Side
- Rds On ( Typ):800mOhm
- Voltage - Load:4.5V ~ 5.5V
- Current - Output ( Max):1A
- Switch Type:General Purpose
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLE7230R provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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