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Rochester Electronics TLD1313EL
TLD1313 - 3 CHANNEL HIGH SIDE CU
Manufacturer # :TLD1313EL
Manufacturer :Rochester Electronics
Dasenic # :TLD1313EL-DS
Datasheet :
TLD1313EL Datasheet
TLD1313EL DatasheetCustomer # :
Description : TLD1313 - 3 CHANNEL HIGH SIDE CU
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.2060 | $ 1.21 |
| 10+ | $ 1.0800 | $ 10.8 |
| 100+ | $ 0.8424 | $ 84.24 |
| 500+ | $ 0.6957 | $ 347.85 |
| 1000+ | $ 0.5490 | $ 549 |
In Stock: 24637
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.206
Total :$ 1.21
Delivery :
Payment :
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TLD1313EL information
Rochester Electronics TLD1313EL technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - LED Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:14-LSSOP (0.154", 3.90mm Width) Exposed Pad
- Frequency:-
- Type:Linear
- Supplier Device Package:PG-SSOP-14
- Internal Switch(s):Yes
- Voltage - Output:40V
- Current - Output / Channel:120mA
- Number of Outputs:3
- Topology:-
- Voltage - Supply ( Max):40V
- Voltage - Supply ( Min):5.5V
- Dimming:-
- Applications:Automotive
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLD1313EL provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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