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1 : $1.1250
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Rochester Electronics TLC7725QP
IC SUPERVISOR 1 CHANNEL 8DIP
Manufacturer # :TLC7725QP
Manufacturer :Rochester Electronics
Dasenic # :TLC7725QP-DS
Datasheet :
TLC7725QP Datasheet
TLC7725QP DatasheetCustomer # :
Description : IC SUPERVISOR 1 CHANNEL 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.1250 | $ 1.13 |
| 25+ | $ 1.1070 | $ 27.68 |
| 100+ | $ 1.0620 | $ 106.2 |
| 500+ | $ 1.0170 | $ 508.5 |
| 1000+ | $ 0.9540 | $ 954 |
In Stock: 7080
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.125
Total :$ 1.13
Delivery :
Payment :
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TLC7725QP information
Rochester Electronics TLC7725QP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Supervisors
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Type:Simple Reset/Power-On Reset
- Supplier Device Package:8-PDIP
- Output:Push-Pull, Totem Pole
- Reset:Active High/Active Low
- Number of Voltages Monitored:1
- Voltage - Threshold:2.25V
- Reset Timeout:1.1ms Minimum
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TLC7725QP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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