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Rochester Electronics TLC374IN
Manufacturer # :TLC374IN
Manufacturer :Rochester Electronics
Dasenic # :TLC374IN-DS
Datasheet : TLC374IN Datasheet
Customer # :
Description : IC DIFF COMPARATOR QUAD 14-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 36362
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5851
Total :$ 0.59
Delivery :
Payment :
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TLC374IN information
Rochester Electronics TLC374IN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Comparators
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:14-DIP (0.300", 7.62mm)
- Type:Differential
- Output Type:CMOS, MOS, Open-Drain, TTL
- Supplier Device Package:14-PDIP
- Number of Elements:4
- Voltage - Supply, Single/ Dual (±):3V ~ 16V, ±1.5V ~ 8V
- Voltage - Input Offset ( Max):5mV @ 5V
- Current - Input Bias ( Max):5pA @ 5V
- Current - Output ( Typ):20mA
- Current - Quiescent ( Max):800µA
- C M R R, P S R R ( Typ):-
- Propagation Delay ( Max):-
- Hysteresis:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLC374IN provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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