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Rochester Electronics TLC372CD

IC DUAL DIFF COMP 8-SOIC
part number has RoHS
Manufacturer # :TLC372CD
Manufacturer :Rochester Electronics
Dasenic # :TLC372CD-DS
Customer # :
Description : IC DUAL DIFF COMP 8-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
100+$ 0.4514$ 45.14
245+$ 0.3704$ 90.75
380+$ 0.3589$ 136.38
520+$ 0.3473$ 180.6
675+$ 0.3357$ 226.6
In Stock: 48848
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4514
Total :$ 0.45
Delivery :
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TLC372CD information

  • Rochester Electronics TLC372CD technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Comparators
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Type:Differential
  • Output Type:CMOS, MOS, Open-Drain, TTL
  • Supplier Device Package:8-SOIC
  • Number of Elements:2
  • Voltage - Supply, Single/ Dual (±):3V ~ 16V, ±1.5V ~ 8V
  • Voltage - Input Offset ( Max):5mV @ 5V
  • Current - Input Bias ( Max):5pA @ 5V
  • Current - Output ( Typ):20mA
  • Current - Quiescent ( Max):400µA
  • C M R R, P S R R ( Typ):-
  • Propagation Delay ( Max):-
  • Hysteresis:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TLC372CD provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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