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Rochester Electronics TLC25M2CPWLE
Manufacturer # :TLC25M2CPWLE
Manufacturer :Rochester Electronics
Dasenic # :TLC25M2CPWLE-DS
Datasheet : TLC25M2CPWLE Datasheet
Customer # :
Description : IC CMOS 2 CIRCUIT 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7883
Total :$ 0.79
Delivery :
Payment :
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TLC25M2CPWLE information
Rochester Electronics TLC25M2CPWLE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP (0.173", 4.40mm Width)
- Current - Supply:285µA (x2 Channels)
- Output Type:Open Drain
- Supplier Device Package:8-TSSOP
- Number of Circuits:2
- Amplifier Type:CMOS
- -3db Bandwidth:-
- Current - Output / Channel:-
- Slew Rate:2.9V/µs
- Gain Bandwidth Product:1.7 MHz
- Current - Input Bias:0.7 pA
- Voltage - Input Offset:1.1 mV
- Voltage - Supply Span ( Min):1.4 V
- Voltage - Supply Span ( Max):16 V
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLC25M2CPWLE provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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