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Rochester Electronics TL7770-5CDW
IC SUPERVISOR 2 CHANNEL 16SOIC
Manufacturer # :TL7770-5CDW
Manufacturer :Rochester Electronics
Dasenic # :TL7770-5CDW-DS
Datasheet :
TL7770-5CDW Datasheet
TL7770-5CDW DatasheetCustomer # :
Description : IC SUPERVISOR 2 CHANNEL 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.0070 | $ 2.01 |
| 25+ | $ 1.9710 | $ 49.28 |
| 100+ | $ 1.8900 | $ 189 |
| 500+ | $ 1.8090 | $ 904.5 |
| 1000+ | $ 1.7100 | $ 1710 |
In Stock: 12226
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.007
Total :$ 2.01
Delivery :
Payment :
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TL7770-5CDW information
Rochester Electronics TL7770-5CDW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Supervisors
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Type:Multi-Voltage Supervisor
- Supplier Device Package:16-SOIC
- Output:Complementary
- Reset:Active High/Active Low
- Number of Voltages Monitored:2
- Voltage - Threshold:5V, Adj
- Reset Timeout:270ns Typical Propagation Delay
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TL7770-5CDW provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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