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1 : $0.4815
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Rochester Electronics TL7702BID
IC SUPERVISOR 1 CHANNEL 8SOIC
Manufacturer # :TL7702BID
Manufacturer :Rochester Electronics
Dasenic # :TL7702BID-DS
Datasheet :
TL7702BID Datasheet
TL7702BID DatasheetCustomer # :
Description : IC SUPERVISOR 1 CHANNEL 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 95+ | $ 0.4815 | $ 45.74 |
| 230+ | $ 0.3951 | $ 90.87 |
| 355+ | $ 0.3828 | $ 135.89 |
| 490+ | $ 0.3704 | $ 181.5 |
| 630+ | $ 0.3581 | $ 225.6 |
In Stock: 19560
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4815
Total :$ 0.48
Delivery :
Payment :
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TL7702BID information
Rochester Electronics TL7702BID technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Supervisors
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Type:Simple Reset/Power-On Reset
- Supplier Device Package:8-SOIC
- Output:Complementary
- Reset:Active High/Active Low
- Number of Voltages Monitored:1
- Voltage - Threshold:2.53V
- Reset Timeout:270ns Typical Propagation Delay
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TL7702BID provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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