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Rochester Electronics TL431CLPG
IC VREF SHUNT ADJ 2.2% TO92-3
Manufacturer # :TL431CLPG
Manufacturer :Rochester Electronics
Dasenic # :TL431CLPG-DS
Datasheet :
TL431CLPG Datasheet
TL431CLPG DatasheetCustomer # :
Description : IC VREF SHUNT ADJ 2.2% TO92-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0900 | $ 0.09 |
In Stock: 8722
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.09
Total :$ 0.09
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TL431CLPG information
Rochester Electronics TL431CLPG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Reference
- Product Status:Active
- Tolerance:±2.2%
- Temperature Coefficient:50ppm/°C Typical
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:TO-226-3, TO-92-3 Long Body
- Current - Supply:-
- Voltage - Input:-
- Output Type:Adjustable
- Supplier Device Package:TO-92 (TO-226)
- Reference Type:Shunt
- Current - Output:100 mA
- Voltage - Output ( Min/ Fixed):2.495V
- Voltage - Output ( Max):36 V
- Noise - 0.1 Hz to 10 Hz:-
- Noise - 10 Hz to 10k Hz:-
- Current - Cathode:1 mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TL431CLPG provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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