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  • Rochester Electronics TL16C2552IFN

    IC DUAL UART 16BYTE FIFO 44-PLCC
  • part number has RoHS
  • Mfr.Part # :TL16C2552IFN
  • Manufacturer :Rochester Electronics
  • Dasenic # :TL16C2552IFN-DS
  • Datasheet :pdf download TL16C2552IFN Datasheet
  • Description : IC DUAL UART 16BYTE FIFO 44-PLCC
  • Package :-
  • Quantity :
    Unit Price : $ 7.371Total : $ 7.37
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 1540
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 7.3710$ 7.37
10 +$ 6.9930$ 69.93
26 +$ 6.6690$ 173.39
104 +$ 6.3900$ 664.56
260 +$ 6.3180$ 1642.68

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Rochester Electronics TL16C2552IFN technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/UARTs (Universal Asynchronous Receiver Transmitter)
Product Status:Active
Features:Internal Oscillator
Mounting Type:Surface Mount
Package / Case:44-LCC (J-Lead)
Number of Channels:2, DUART
Supplier Device Package:44-PLCC (16.58x16.58)
Data Rate ( Max):1.5Mbps
Voltage - Supply:1.8V ~ 5V
Protocol:-
F I F O's:16 Byte
With Auto Flow Control:Yes
With Ir D A Encoder/ Decoder:-
With False Start Bit Detection:Yes
With Modem Control:Yes
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
TL16C2552IFN provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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