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1 : $0.3176
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Rochester Electronics TIP137G
TRANS PNP DARL 100V 8A TO220
Manufacturer # :TIP137G
Manufacturer :Rochester Electronics
Dasenic # :TIP137G-DS
Datasheet :
TIP137G Datasheet
TIP137G DatasheetCustomer # :
Description : TRANS PNP DARL 100V 8A TO220
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.3176 | $ 0.32 |
| 200+ | $ 0.1229 | $ 24.58 |
| 500+ | $ 0.1186 | $ 59.3 |
| 1000+ | $ 0.1165 | $ 116.5 |
In Stock: 2269
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3176
Total :$ 0.32
Delivery :
Payment :
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TIP137G information
Rochester Electronics TIP137G technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
- Product Status:Active
- Operating Temperature:150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Power - Max:2 W
- Supplier Device Package:TO-220
- Transistor Type:PNP - Darlington
- Current - Collector ( Ic) ( Max):8 A
- Voltage - Collector Emitter Breakdown ( Max):100 V
- Vce Saturation ( Max) @ Ib, Ic:4V @ 30mA, 6A
- Current - Collector Cutoff ( Max):500µA
- D C Current Gain (h F E) ( Min) @ Ic, Vce:1000 @ 4A, 4V
- Frequency - Transition:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TIP137G provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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