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1 : $0.2457
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Rochester Electronics TIP111TU
TRANS NPN DARL 80V 2A TO220-3
Manufacturer # :TIP111TU
Manufacturer :Rochester Electronics
Dasenic # :TIP111TU-DS
Datasheet :
TIP111TU Datasheet
TIP111TU DatasheetCustomer # :
Description : TRANS NPN DARL 80V 2A TO220-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 3+ | $ 0.2457 | $ 0.74 |
| 25+ | $ 0.2187 | $ 5.47 |
| 100+ | $ 0.2052 | $ 20.52 |
In Stock: 12903
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2457
Total :$ 0.25
Delivery :
Payment :
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TIP111TU information
Rochester Electronics TIP111TU technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
- Product Status:Active
- Operating Temperature:150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Power - Max:2 W
- Supplier Device Package:TO-220-3
- Transistor Type:NPN - Darlington
- Current - Collector ( Ic) ( Max):2 A
- Voltage - Collector Emitter Breakdown ( Max):80 V
- Vce Saturation ( Max) @ Ib, Ic:2.5V @ 8mA, 2A
- Current - Collector Cutoff ( Max):2mA
- D C Current Gain (h F E) ( Min) @ Ic, Vce:1000 @ 1A, 4V
- Frequency - Transition:-
- US ECCN:EAR99
- HTS US:8541.29.0095
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TIP111TU provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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