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Rochester Electronics THS8200IPFPEP

IC VIDEO DAC 10BIT 80HTQFP
part number has RoHS
Manufacturer # :THS8200IPFPEP
Manufacturer :Rochester Electronics
Dasenic # :THS8200IPFPEP-DS
Customer # :
Description : IC VIDEO DAC 10BIT 80HTQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 18.7020$ 18.7
25+$ 18.3240$ 458.1
100+$ 17.5770$ 1757.7
500+$ 16.8300$ 8415
1000+$ 15.8940$ 15894
In Stock: 5883
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.702
Total :$ 18.70
Delivery :
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THS8200IPFPEP information

  • Rochester Electronics THS8200IPFPEP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:80-TQFP Exposed Pad
  • Type:Video DAC
  • Number of Channels:3
  • Supplier Device Package:80-HTQFP (12x12)
  • Voltage - Supply:1.65V ~ 2V, 3V ~ 3.6V
  • Resolution ( Bits):10 b
  • Sampling Rate ( Per Second):-
  • Data Interface:Serial
  • Voltage Supply Source:Analog and Digital
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
THS8200IPFPEP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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