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Rochester Electronics THS4121CDGN
Manufacturer # :THS4121CDGN
Manufacturer :Rochester Electronics
Dasenic # :THS4121CDGN-DS
Datasheet : THS4121CDGN Datasheet
Customer # :
Description : IC OPAMP DIFF 1 CIRCUIT 8HVSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 32981
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.708
Total :$ 3.71
Delivery :
Payment :
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THS4121CDGN information
Rochester Electronics THS4121CDGN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Current - Supply:11mA
- Output Type:Differential
- Supplier Device Package:8-HVSSOP
- Number of Circuits:1
- Amplifier Type:Differential
- -3db Bandwidth:100 MHz
- Current - Output / Channel:100 mA
- Slew Rate:55V/µs
- Gain Bandwidth Product:-
- Current - Input Bias:1.2 pA
- Voltage - Input Offset:3 mV
- Voltage - Supply Span ( Min):3 V
- Voltage - Supply Span ( Max):3.5 V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
THS4121CDGN provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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