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Rochester Electronics TDA5225C

QUAD-CONFIGURATION RECEIVER
part number has RoHS
Manufacturer # :TDA5225C
Manufacturer :Rochester Electronics
Dasenic # :TDA5225C-DS
Customer # :
Description : QUAD-CONFIGURATION RECEIVER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.9990$ 1
25+$ 0.9810$ 24.53
100+$ 0.9360$ 93.6
500+$ 0.8991$ 449.55
1000+$ 0.8492$ 849.2
In Stock: 7710
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.999
Total :$ 1.00
Delivery :
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Payment :
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TDA5225C information

  • Rochester Electronics TDA5225C technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Receivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C
  • Features:RSSI Equipped
  • Mounting Type:Surface Mount
  • Package / Case:28-TSSOP (0.173", 4.40mm Width)
  • Frequency:300MHz ~ 928MHz
  • Sensitivity:-120dBm
  • Supplier Device Package:PG-TSSOP-28
  • Data Rate ( Max):-
  • Memory Size:-
  • Voltage - Supply:3V ~ 3.6V, 4.5V ~ 5.5V
  • Data Interface:SPI
  • Modulation or Protocol:ASK, FSK
  • Current - Receiving:15mA
  • Antenna Connector:PCB, Surface Mount
  • Applications:Alarm Systems, Communication Systems, RKE
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TDA5225C provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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