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1 : $163.4000
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Rochester Electronics TD390N16SOFHPSA1
LA-T-BOND MODULE
Manufacturer # :TD390N16SOFHPSA1
Manufacturer :Rochester Electronics
Dasenic # :TD390N16SOFHPSA1-DS
Datasheet :
TD390N16SOFHPSA1 Datasheet
TD390N16SOFHPSA1 DatasheetCustomer # :
Description : LA-T-BOND MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 163.4000 | $ 163.4 |
In Stock: 1518
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 163.4
Total :$ 163.40
Delivery :
Payment :
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TD390N16SOFHPSA1 information
Rochester Electronics TD390N16SOFHPSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Thyristors - SCRs - Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TC)
- Mounting Type:Chassis Mount
- Package / Case:Module
- Structure:Series Connection - SCR/Diode
- Current - Hold ( Ih) ( Max):150 mA
- Voltage - Off State:1.6 kV
- Number of S C Rs, Diodes:1 SCR, 1 Diode
- Current - On State ( It ( A V)) ( Max):380 A
- Current - On State ( It ( R M S)) ( Max):520 A
- Voltage - Gate Trigger ( Vgt) ( Max):2 V
- Current - Gate Trigger ( Igt) ( Max):150 mA
- Current - Non Rep. Surge 50, 60 Hz ( Itsm):9500A @ 50Hz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.30.0080
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TD390N16SOFHPSA1 provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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