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Rochester Electronics TD170N12KOFHPSA1
Manufacturer # :TD170N12KOFHPSA1
Manufacturer :Rochester Electronics
Dasenic # :TD170N12KOFHPSA1-DS
Datasheet : TD170N12KOFHPSA1 Datasheet
Customer # :
Description : SCR MODULE 1800V 350A MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 229.92
Total :$ 229.92
Delivery :
Payment :
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TD170N12KOFHPSA1 information
Rochester Electronics TD170N12KOFHPSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Thyristors - SCRs - Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Chassis Mount
- Package / Case:Module
- Structure:Series Connection - SCR/Diode
- Current - Hold ( Ih) ( Max):300 mA
- Voltage - Off State:1.8 kV
- Number of S C Rs, Diodes:1 SCR, 1 Diode
- Current - On State ( It ( A V)) ( Max):223 A
- Current - On State ( It ( R M S)) ( Max):350 A
- Voltage - Gate Trigger ( Vgt) ( Max):2 V
- Current - Gate Trigger ( Igt) ( Max):200 mA
- Current - Non Rep. Surge 50, 60 Hz ( Itsm):5200A @ 50Hz
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.30.0080
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TD170N12KOFHPSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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