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  • Rochester Electronics TAS5624ADDV

    IC AMP D MONO/STER 400W 44HTSSOP
  • part number has RoHS
  • Mfr.Part # :TAS5624ADDV
  • Manufacturer :Rochester Electronics
  • Dasenic # :TAS5624ADDV-DS
  • Datasheet :pdf download TAS5624ADDV Datasheet
  • Description : IC AMP D MONO/STER 400W 44HTSSOP
  • Package :-
  • Quantity :
    Unit Price : $ 7.1217Total : $ 7.12
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 9042
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
7 +$ 7.1217$ 49.85
16 +$ 5.8437$ 93.50
24 +$ 5.6610$ 135.86
33 +$ 5.4783$ 180.78
43 +$ 5.2965$ 227.75

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Rochester Electronics TAS5624ADDV technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Amplifiers - Audio
Product Status:Active
Operating Temperature:0°C ~ 70°C (TA)
Features:Depop, Digital Inputs, Short-Circuit and Thermal Protection, Shutdown
Mounting Type:Surface Mount
Package / Case:44-TSSOP (0.244", 6.20mm Width) Exposed Pad
Type:Class D
Output Type:1-Channel (Mono) or 2-Channel (Stereo)
Supplier Device Package:44-HTSSOP
Voltage - Supply:12V ~ 38V
Max Output Power x Channels @ Load:400W x 1 @ 1.5Ohm; 200W x 2 @ 3Ohm
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.33.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
TAS5624ADDV provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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