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Rochester Electronics TAS5186ADDV

IC AMP D 6 CHAN 60W 44HTSSOP
part number has RoHS
Manufacturer # :TAS5186ADDV
Manufacturer :Rochester Electronics
Dasenic # :TAS5186ADDV-DS
Customer # :
Description : IC AMP D 6 CHAN 60W 44HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 10.0440$ 10.04
25+$ 9.8460$ 246.15
100+$ 9.4410$ 944.1
500+$ 9.0360$ 4518
1000+$ 8.5410$ 8541
In Stock: 12045
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.044
Total :$ 10.04
Delivery :
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Payment :
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TAS5186ADDV information

  • Rochester Electronics TAS5186ADDV technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Features:Digital Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:44-TSSOP (0.244", 6.20mm Width) Exposed Pad
  • Type:Class D
  • Output Type:6-Channel
  • Supplier Device Package:44-HTSSOP
  • Voltage - Supply:10.8V ~ 13.2V
  • Max Output Power x Channels @ Load:60W x 1 @ 3Ohm; 30W x 5 @ 6Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TAS5186ADDV provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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