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Rochester Electronics TAS3108IADCP
IC AUDIO SGNL PROCESSOR 38HTSSOP
Manufacturer # :TAS3108IADCP
Manufacturer :Rochester Electronics
Dasenic # :TAS3108IADCP-DS
Datasheet :
TAS3108IADCP Datasheet
TAS3108IADCP DatasheetCustomer # :
Description : IC AUDIO SGNL PROCESSOR 38HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 9.5220 | $ 9.52 |
| 25+ | $ 9.3330 | $ 233.33 |
| 100+ | $ 8.9550 | $ 895.5 |
| 500+ | $ 8.5680 | $ 4284 |
| 1000+ | $ 8.0910 | $ 8091 |
In Stock: 1522
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.522
Total :$ 9.52
Delivery :
Payment :
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TAS3108IADCP information
Rochester Electronics TAS3108IADCP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Not For New Designs
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:38-TFSOP (0.173", 4.40mm Width) Exposed Pad
- Number of Channels:4
- Interface:I²C
- Specifications:-
- Supplier Device Package:38-HTSSOP
- Voltage - Supply:3V ~ 3.6V
- Applications:Automotive Audio, Consumer Audio
- Function:Audio Signal Processor
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TAS3108IADCP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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