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Rochester Electronics T1020NSE7PQB
Manufacturer # :T1020NSE7PQB
Manufacturer :Rochester Electronics
Dasenic # :T1020NSE7PQB-DS
Datasheet : T1020NSE7PQB Datasheet
Customer # :
Description : IC SOC 2CORE 1400MHZ SW 780FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1502
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 247.4
Total :$ 247.40
Delivery :
Payment :
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T1020NSE7PQB information
Rochester Electronics T1020NSE7PQB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microprocessors
- Product Status:Active
- Operating Temperature:0°C ~ 105°C (TA)
- Package / Case:780-FBGA, FCBGA
- Supplier Device Package:780-FCPBGA (23x23)
- Voltage - I/ O:-
- Speed:1.4GHz
- Core Processor:PowerPC e5500
- Number of Cores/ Bus Width:2 Core, 64-Bit
- Co- Processors/ D S P:-
- R A M Controllers:DDR3L/4
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:1Gbps (12)
- S A T A:SATA 3Gbps (2)
- U S B:USB 2.0 + PHY (2)
- Security Features:Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A002A1
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
T1020NSE7PQB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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