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Rochester Electronics SY898535XLKY

IC CLK BUFFER 2:4 235MHZ 20TSSOP
part number has RoHS
Manufacturer # :SY898535XLKY
Manufacturer :Rochester Electronics
Dasenic # :SY898535XLKY-DS
Customer # :
Description : IC CLK BUFFER 2:4 235MHZ 20TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.7510$ 5.75
25+$ 5.6340$ 140.85
100+$ 5.4090$ 540.9
500+$ 5.1750$ 2587.5
1000+$ 4.8870$ 4887
In Stock: 1648
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.751
Total :$ 5.75
Delivery :
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Payment :
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SY898535XLKY information

  • Rochester Electronics SY898535XLKY technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:20-TSSOP (0.173", 4.40mm Width)
  • Type:Fanout Buffer (Distribution), Multiplexer
  • Supplier Device Package:20-TSSOP
  • Frequency - Max:235 MHz
  • Number of Circuits:1
  • Output:LVPECL
  • Voltage - Supply:3.135V ~ 3.465V
  • Input:LVCMOS, LVTTL, Crystal
  • Ratio - Input: Output:2:4
  • Differential - Input: Output:No/Yes
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SY898535XLKY provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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