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Rochester Electronics SY100EP111UTG

IC CLK BUFFER 2:10 3GHZ 32TQFP
part number has RoHS
Manufacturer # :SY100EP111UTG
Manufacturer :Rochester Electronics
Dasenic # :SY100EP111UTG-DS
Customer # :
Description : IC CLK BUFFER 2:10 3GHZ 32TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.5640$ 3.56
25+$ 2.9700$ 74.25
100+$ 2.7000$ 270
1000+$ 2.6100$ 2610
5000+$ 2.5830$ 12915
In Stock: 2000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.564
Total :$ 3.56
Delivery :
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Payment :
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SY100EP111UTG information

  • Rochester Electronics SY100EP111UTG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-TQFP
  • Type:Fanout Buffer (Distribution), Multiplexer
  • Supplier Device Package:32-TQFP (7x7)
  • Frequency - Max:3 GHz
  • Number of Circuits:1
  • Output:LVECL, LVPECL
  • Voltage - Supply:2.375V ~ 3.8V
  • Input:HSTL, LVECL, LVPECL
  • Ratio - Input: Output:2:10
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SY100EP111UTG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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