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Rochester Electronics STK681-200-E
IC HYBRID MOTOR DRIVER 11SIP
Manufacturer # :STK681-200-E
Manufacturer :Rochester Electronics
Dasenic # :STK681-200-E-DS
Datasheet :
STK681-200-E Datasheet
STK681-200-E DatasheetCustomer # :
Description : IC HYBRID MOTOR DRIVER 11SIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
In Stock: 64
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
Payment :
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STK681-200-E information
Rochester Electronics STK681-200-E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Obsolete
- Operating Temperature:150°C (TJ)
- Features:-
- Mounting Type:Through Hole
- Package / Case:12-SIP, 11 Leads
- Technology:Power MOSFET, IGBT
- Interface:Logic
- Supplier Device Package:12-SIP
- Voltage - Supply:4.75V ~ 5.25V
- Current - Output / Channel:4.2A
- Current - Peak Output:-
- Fault Protection:-
- Output Configuration:Half Bridge (2)
- Load Type:Inductive
- Rds On ( Typ):-
- Voltage - Load:10V ~ 42V
- Applications:DC Motors, General Purpose
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
STK681-200-E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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