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Rochester Electronics STK57FU394AG-E
Manufacturer # :STK57FU394AG-E
Manufacturer :Rochester Electronics
Dasenic # :STK57FU394AG-E-DS
Datasheet : STK57FU394AG-E Datasheet
Customer # :
Description : 2-IN-1 PFC AND INVERTER IPM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1515
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 24.36
Total :$ 24.36
Delivery :
Payment :
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STK57FU394AG-E information
Rochester Electronics STK57FU394AG-E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Obsolete
- Operating Temperature:150°C (TJ)
- Features:Bootstrap Circuit
- Mounting Type:Through Hole
- Package / Case:35-SSIP, 25 Leads
- Technology:IGBT
- Interface:Logic
- Supplier Device Package:35-SIP/SIP2A-3
- Voltage - Supply:12.5V ~ 17.5V
- Current - Output / Channel:15A
- Current - Peak Output:30A
- Fault Protection:Current Limiting, UVLO
- Output Configuration:Half Bridge (3)
- Load Type:Inductive
- Rds On ( Typ):-
- Voltage - Load:400V (Max)
- Applications:AC Motors, DC Motors, General Purpose
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
STK57FU394AG-E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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