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Rochester Electronics SSM2304CPZ-REEL

IC AMP AUDIO 2.4W STER D 16LFCSP
part number has RoHS
Manufacturer # :SSM2304CPZ-REEL
Manufacturer :Rochester Electronics
Dasenic # :SSM2304CPZ-REEL-DS
Customer # :
Description : IC AMP AUDIO 2.4W STER D 16LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.9090$ 0.91
25+$ 0.8908$ 22.27
100+$ 0.8545$ 85.45
500+$ 0.8181$ 409.05
1000+$ 0.7727$ 772.7
In Stock: 31350
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.909
Total :$ 0.91
Delivery :
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SSM2304CPZ-REEL information

  • Rochester Electronics SSM2304CPZ-REEL technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:16-VFQFN Exposed Pad, CSP
  • Type:Class D
  • Output Type:2-Channel (Stereo)
  • Supplier Device Package:16-LFCSP-VQ (3x3)
  • Voltage - Supply:2.5V ~ 5V
  • Max Output Power x Channels @ Load:2.4W x 2 @ 4Ohm
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SSM2304CPZ-REEL provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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