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Rochester Electronics SSM2250RMZ-R2

IC AMP AUDIO PWR 1.5W AB 10MSOP
part number has RoHS
Manufacturer # :SSM2250RMZ-R2
Manufacturer :Rochester Electronics
Dasenic # :SSM2250RMZ-R2-DS
Customer # :
Description : IC AMP AUDIO PWR 1.5W AB 10MSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.3230$ 1.32
25+$ 1.2960$ 32.4
100+$ 1.2420$ 124.2
500+$ 1.1880$ 594
1000+$ 1.1250$ 1125
In Stock: 4902
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.323
Total :$ 1.32
Delivery :
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Payment :
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SSM2250RMZ-R2 information

  • Rochester Electronics SSM2250RMZ-R2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Obsolete
  • Operating Temperature:-
  • Features:Depop, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Type:Class AB
  • Output Type:1-Channel (Mono) with Stereo Headphones
  • Supplier Device Package:10-MSOP
  • Voltage - Supply:2.7V ~ 6V
  • Max Output Power x Channels @ Load:1.5W x 1 @ 8Ohm; 90mW x 2 @ 32Ohm
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SSM2250RMZ-R2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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