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Rochester Electronics SPC5747CK0AVMN6
Manufacturer # :SPC5747CK0AVMN6
Manufacturer :Rochester Electronics
Dasenic # :SPC5747CK0AVMN6-DS
Datasheet : SPC5747CK0AVMN6 Datasheet
Customer # :
Description : IC MCU 32BIT 4MB FLASH 324MAPBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3528
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 23.976
Total :$ 23.98
Delivery :
Payment :
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SPC5747CK0AVMN6 information
Rochester Electronics SPC5747CK0AVMN6 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:324-LBGA
- Supplier Device Package:324-MAPBGA (19x19)
- Peripherals:DMA, LVD, POR, WDT
- Number of I/ O:246
- Speed:80MHz/160MHz
- E E P R O M Size:-
- Core Processor:e200z2, e200z4
- R A M Size:512K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Dual-Core
- Connectivity:CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Program Memory Size:4MB (4M x 8)
- Voltage - Supply ( Vcc/ Vdd):3V ~ 5.5V
- Data Converters:A/D 80x10b, 64x12b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A992C
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SPC5747CK0AVMN6 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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