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1 : $6.2640
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Rochester Electronics SP514CF
WAN MULTI-MODE SERIAL TRANSCVR
Manufacturer # :SP514CF
Manufacturer :Rochester Electronics
Dasenic # :SP514CF-DS
Datasheet :
SP514CF Datasheet
SP514CF DatasheetCustomer # :
Description : WAN MULTI-MODE SERIAL TRANSCVR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 6.2640 | $ 6.26 |
| 25+ | $ 6.1380 | $ 153.45 |
| 100+ | $ 5.8860 | $ 588.6 |
| 500+ | $ 5.6340 | $ 2817 |
| 1000+ | $ 5.3280 | $ 5328 |
In Stock: 1548
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.264
Total :$ 6.26
Delivery :
Payment :
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SP514CF information
Rochester Electronics SP514CF technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver Modules and Modems
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Frequency:-
- Sensitivity:-
- Utilized I C / Part:-
- Memory Size:-
- Voltage - Supply:-
- Power - Output:-
- Protocol:-
- Data Rate:-
- Serial Interfaces:-
- R F Family/ Standard:-
- Antenna Type:-
- Current - Receiving:-
- Modulation:-
- Current - Transmitting:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:3A991
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SP514CF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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