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Rochester Electronics SN74LVC157APWE4

IC MULTIPLEXER 4 X 2:1 16TSSOP
part number has RoHS
Manufacturer # :SN74LVC157APWE4
Manufacturer :Rochester Electronics
Dasenic # :SN74LVC157APWE4-DS
Customer # :
Description : IC MULTIPLEXER 4 X 2:1 16TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.1404$ 1.4
385+$ 0.1170$ 45.05
935+$ 0.0963$ 90.04
1445+$ 0.0936$ 135.25
2000+$ 0.0900$ 180
In Stock: 44177
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1404
Total :$ 0.14
Delivery :
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Payment :
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SN74LVC157APWE4 information

  • Rochester Electronics SN74LVC157APWE4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:16-TSSOP (0.173", 4.40mm Width)
  • Type:Multiplexer
  • Supplier Device Package:16-TSSOP
  • Voltage - Supply:2V ~ 3.6V
  • Voltage Supply Source:Single Supply
  • Current - Output High, Low:24mA, 24mA
  • Circuit:4 x 2:1
  • Independent Circuits:1
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LVC157APWE4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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