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Rochester Electronics SN74LVC126APW
IC BUF NON-INVERT 3.6V 14TSSOP
Manufacturer # :SN74LVC126APW
Manufacturer :Rochester Electronics
Dasenic # :SN74LVC126APW-DS
Datasheet :
SN74LVC126APW Datasheet
SN74LVC126APW DatasheetCustomer # :
Description : IC BUF NON-INVERT 3.6V 14TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 0.1004 | $ 1 |
| 540+ | $ 0.0837 | $ 45.2 |
| 1150+ | $ 0.0783 | $ 90.05 |
| 1790+ | $ 0.0756 | $ 135.32 |
| 2565+ | $ 0.0702 | $ 180.06 |
In Stock: 47882
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1004
Total :$ 0.10
Delivery :
Payment :
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SN74LVC126APW information
Rochester Electronics SN74LVC126APW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width)
- Input Type:-
- Output Type:3-State
- Supplier Device Package:14-TSSOP
- Number of Elements:4
- Voltage - Supply:1.65V ~ 3.6V
- Logic Type:Buffer, Non-Inverting
- Number of Bits per Element:1
- Current - Output High, Low:24mA, 24mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LVC126APW provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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