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Rochester Electronics SN74LV02ADG4

IC GATE NOR 4CH 2-INP 14SOIC
part number has RoHS
Manufacturer # :SN74LV02ADG4
Manufacturer :Rochester Electronics
Dasenic # :SN74LV02ADG4-DS
Customer # :
Description : IC GATE NOR 4CH 2-INP 14SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.2183$ 2.22
25+$ 2.1739$ 54.35
100+$ 2.0852$ 208.52
500+$ 1.9965$ 998.25
1000+$ 1.8855$ 1885.5
In Stock: 3600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.2183
Total :$ 2.22
Delivery :
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Payment :
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SN74LV02ADG4 information

  • Rochester Electronics SN74LV02ADG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Gates and Inverters
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:14-SOIC
  • Number of Circuits:4
  • Voltage - Supply:2V ~ 5.5V
  • Number of Inputs:2
  • Current - Quiescent ( Max):20 µA
  • Logic Type:NOR Gate
  • Current - Output High, Low:12mA, 12mA
  • Max Propagation Delay @ V, Max C L:7.5ns @ 5V, 50pF
  • Logic Level - Low:0.5V
  • Logic Level - High:1.5V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LV02ADG4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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